These substrates consist of screen printed conductor layers, separated by dielectric layers, which can be interconnected by vias. This allows high density interconnection.

Features

  • Ten layers or more available with our standard process
  • 10 mil square vias or larger available with our standard process
  • Dielectrics available that will allow intermixing of gold and silver metallization
  • Multilayer capability both front and back with through hole interconnections