This technology is used in demanding applications where long life, thermal endurance, mechanical strength, thermal conductivity, high density electrical interconnection, low dielectric losses, etc., are needed.

Features

  • Through hole connections from front to back of ceramic standard process
  • Screen printed resistors on both front and back is standard process
  • Gold conductors can be wire bonded with both gold wire and/or alumina wire
  • Solderable metallization is available that can be integrated with gold wire bondable conductors
  • Solderable metallization is compatible with lead free solders
  • Integrated capacitors are available with this technology
  • Resistors available from 0.100 ohm/square up to gig-ohm values
  • Laser trimming of resistors down to +/- 1%