At CMS Circuit Solutions, we provide accurate, reliable, and cost effective solutions for custom thick film substrate manufacturing. We use the newest available technologies for precision screen printing conductive, resistive, and insulating pastes and fusing them at high temperatures onto a ceramic substrate. We manufacture thick film substrates with multiple layers and ceramic vias that can be coated or filled with various conductive materials. Using screen printing technology, we can produce 0.004” lines with 0.004” spacing, and for applications where tighter spacing is required, we can etch line widths of 0.001” with 0.001” spacing. Our standard substrate materials include alumina, aluminum nitride, and beryllium oxide as well as sapphire and ferrite.
This technology is used in demanding applications where long life, thermal endurance, mechanical strength, thermal conductivity, high density electrical interconnection, low dielectric losses, etc., are needed. Click here for more info.
For product with much tighter spacing requirements, etched thick film substrates are the best solution and are more cost effective. Click here to find out if our etched substrates are the right choice for your needs.
These substrates consist of screen printed conductor layers, separated by dielectric layers, which can be interconnected by vias. This allows high density interconnection. Click here for more info.
When standard thick film processes aren’t able to work with a design, multiple processes can be incorporated to achieve strict design requirements. Click here to check out some of our special features.
Printed lines down to 4 mil (0.004 inches) in width with 4 mil spaces
Lines and spaces to 1 mil