These substrates consist of screen printed conductor layers, separated by dielectric layers, which can be interconnected by vias. This allows high density interconnection.
Features
- Ten layers or more available with our standard process
- 10 mil square vias or larger available with our standard process
- Dielectrics available that will allow intermixing of gold and silver metallization
- Multilayer capability both front and back with through hole interconnections
Product Examples
