This technology is used in demanding applications where long life, thermal endurance, mechanical strength, thermal conductivity, high density electrical interconnection, low dielectric losses, etc., are needed.
Features
- Through hole connections from front to back of ceramic standard process
- Screen printed resistors on both front and back is standard process
- Gold conductors can be wire bonded with both gold wire and/or alumina wire
- Solderable metallization is available that can be integrated with gold wire bondable conductors
- Solderable metallization is compatible with lead free solders
- Integrated capacitors are available with this technology
- Resistors available from 0.100 ohm/square up to gig-ohm values
- Laser trimming of resistors down to +/- 1%
Product Examples
